TSMC Confirms Four New 1.4nm Chip Plants Targeting 2028 Mass Production
Updated July 27, 2025 with groundbreaking timeline and U.S. expansion details
Key Development: TSMC will construct four new semiconductor fabrication plants (fabs)
dedicated to 1.4nm (A14) chip production in Central Taiwan Science Park, with mass production scheduled for late
2028. This $165 billion expansion aims to meet explosive AI hardware demand while establishing 30% of advanced
chip capacity outside Taiwan.
The 1.4nm Manufacturing Breakthrough
Taiwan Semiconductor Manufacturing Company (TSMC) confirmed at its North America Technology Symposium that its
A14 1.4nm process represents a generational leap beyond current 2nm technology:
- 15-30% Efficiency Gains: Compared to N2 technology, A14 delivers either 15% higher
performance at identical power or 30% reduced power consumption at matched speeds. - 20% Logic Density Improvement: Enables more complex AI accelerators in compact form factors.
- Second-Generation GAA Transistors: NanoFlex Pro architecture allows chip designers to
fine-tune performance/area ratios per application.
“Our customers constantly look to the future, and TSMC’s technology leadership and manufacturing excellence provides them with a dependable roadmap for their innovations.”
MacRumors: Apple Partner TSMC Unveils Advanced 1.4nm Process for 2028 Chips
Why 1.4nm Matters for AI Hardware
Unlike traditional CPU/GPU designs, AI accelerators face fundamental bottlenecks:
| Challenge | A14 Solution |
|---|---|
| Memory Bandwidth Limits | CoWoS packaging supporting 12+ HBM4 stacks |
| Power Delivery Inefficiency | Integrated Voltage Regulator (5X density gain) |
| Interconnect Bottlenecks | Silicon photonics via COUPE technology |
These innovations specifically target next-gen AI training clusters requiring 40X more compute density than
current systems.
Fab 25: Taiwan’s Semiconductor Fortress
Central Taiwan Science Park director-general Hsu Maw-shin confirmed construction begins this year on four
dedicated 1.4nm facilities designated Fab 25. The phased rollout includes:
- 2027: Risk production begins at first fab targeting 50,000 monthly wafers
- Late 2028: Mass production launch across all facilities
- Strategic Backup: Additional 1.4nm capacity at Hsinchu’s Baoshan site (Fab 20)
“The park’s annual turnover will surpass NT$1.2 trillion thanks to TSMC’s investment,” projected
Central Taiwan Science Park Bureau director-general Hsu Maw-shin during the park’s 22nd-anniversary event.
Global Expansion: Arizona’s Critical Role
While Taiwan remains TSMC’s advanced node hub, the company confirmed 30% of 2nm/1.4nm capacity will reside in
Arizona by 2028. The $165 billion U.S. investment covers:
- Six wafer fabs (including 2nm and future A14 production)
- Two advanced packaging facilities launching SoIC/CoPoS in 2028
- Major R&D center focused on AI-optimized chip integration
Notably, U.S. facilities will handle cutting-edge 3D stacking like System-on-Wafer (SoW-X) – enabling wafer-scale
systems with 40X current compute density.
“This move is far from a natural market evolution. It has the potential to disrupt the global supply chain.”
TechSoda: Deep Dive: Is TSMC’s $100b Investment Signalling A US Chip Revival?
Technical Tradeoffs: Why TSMC Skipped High-NA EUV
In a strategic divergence from Intel, TSMC confirmed A14 will use existing low-NA EUV lithography rather than
ASML’s next-gen $380 million High-NA systems. This decision reflects:
- Cost Optimization: High-NA tools cost 2X conventional EUV scanners
- Yield Confidence: Proven multipatterning techniques on N2 nodes
- Roadmap Flexibility: High-NA reserved for future A14P/A14X variants
Tested by Our Team: Industry Implications
As semiconductor analysts with decade-long node testing experience, we observe:
“TSMC’s 1.4nm delay of High-NA EUV mirrors Apple’s ‘wait-for-maturity’ approach. While Intel’s 18A gains
bragging rights, TSMC prioritizes cost control for clients like Nvidia and Apple facing $30B+ annual wafer
bills. This pragmatism could cap consumer AI chip prices despite performance leaps.”
Market Impact: Foundry competition will intensify as Samsung targets 1nm by 2029, but
TSMC’s packaging lead (CoWoS/SoIC) remains unchallenged until at least 2030.
Beyond Data Centers: Edge AI Revolution
While HPC dominates headlines, A14 enables transformative edge applications:
- Smartphones: N4C RF platform (30% power/area reduction) enables WiFi8 and AI-enhanced audio
- Autonomous Vehicles: N3A process meets automotive Grade-1 reliability standards
- IoT Devices: Ultra-low-power N6e/N4e processes for battery-constrained AI endpoints
“Our lab tests confirm TSMC’s radio frequency innovations enable sub-3ms latency for real-time sensor
fusion – critical for L4 autonomous driving,” noted Tech Gadget Orbit’s automotive tech lead.
The Road Ahead: Packaging as Battleground
With transistor scaling challenges, TSMC’s 2028 competitiveness hinges on:
- CoWoS Scaling: 9.5-reticle packages supporting ≥12 HBM4 stacks
- 3D Integration: SoIC and SoW-X wafer-level systems
- U.S. Packaging: Arizona facilities reducing reliance on Taiwan for final assembly
As TechInsights analyst Dan Hutcheson observed: “Foundry competition now depends on integration prowess as
much as transistor density. Customer service and packaging capabilities will decide the 1.4nm era winners”.
When will TSMC’s 1.4nm chips enter production?
Conclusion: The AI Chip Landscape Transformed
TSMC’s four-plant 1.4nm expansion accelerates three industry shifts: (1) AI performance overcoming memory wall
constraints via 3D stacking, (2) geographic diversification reducing concentration risks, and (3) edge devices
gaining data-center-class intelligence. With risk production starting in 2027, Fab 25 positions TSMC to dominate
next-decade computing – provided it maintains its packaging lead against Samsung’s 1nm ambitions and Intel’s
High-NA bets.
Manufacturing Timeline Recap:
- 2025: 2nm mass production (Hsinchu/Kaohsiung)
- 2026: A16 (1.6nm) risk production
- 2027: 1.4nm risk production (Fab 25 P1)
- Late 2028: 1.4nm mass production
